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Wolfspeed, Inc.

WOLF

WOLF: Wolfspeed Inc is involved in the manufacturing of wide bandgap semiconductors. It is focused on silicon carbide and gallium nitride materials and devices for power and radio-frequency (RF) applications. The company serves applications such as transportation, power supplies, inverters, and wireless systems. Geographically, it derives a majority of revenue from Europe and also has a presence in the United States; China; Japan; South Korea, and other countries.

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  • Patent Title: Semiconductor having a backside wafer cavity for radio frequency (rf) passive device integration and/or improved cooling and process of implementing the same Aug. 22, 2023
  • Patent Title: Power module Aug. 22, 2023
  • Patent Title: Methods of forming semiconductor power devices having graded lateral doping Aug. 08, 2023
  • Patent Title: Power module Aug. 08, 2023
  • Patent Title: Wirebond-constructed inductors Aug. 01, 2023
  • Patent Title: High power multilayer module having low inductance and fast switching for paralleling power devices Jul. 04, 2023
  • Patent Title: Integrated passive device (ipd) components and a package and processes implementing the same Jun. 27, 2023
  • Patent Title: Interface layer control methods for semiconductor power devices and semiconductor devices formed thereof Jun. 20, 2023
  • Patent Title: Packaged electronic circuits having moisture protection encapsulation and methods of forming same Jun. 20, 2023
  • Patent Title: Radio frequency transistor amplifiers having multi-layer encapsulations that include functional electrical circuits Jun. 13, 2023
  • Patent Title: Rf amplifier devices including interconnect structures and methods of manufacturing Jun. 06, 2023
  • Patent Title: Semiconductor devices having gate resistors with low variation in resistance values May. 30, 2023
  • Patent Title: Semiconductor power devices having multiple gate trenches and methods of forming such devices May. 30, 2023
  • Patent Title: Wide bandgap field effect transistors with source connected field plates May. 30, 2023
  • Patent Title: Semiconductor devices for improved measurements and related methods May. 30, 2023
  • Patent Title: Field effect transistor with enhanced reliability May. 23, 2023
  • Patent Title: Semiconductors with improved thermal budget and process of making semiconductors with improved thermal budget May. 23, 2023
  • Patent Title: Silicon carbide wafers with relaxed positive bow and related methods May. 23, 2023
  • Patent Title: Power modules having an integrated clamp circuit and process thereof May. 16, 2023
  • Patent Title: Power modules having an integrated clamp circuit and process thereof May. 16, 2023
  • Patent Title: Transistor level input and output harmonic terminations May. 16, 2023
  • Patent Title: Radio frequency transistor amplifiers having engineered intrinsic capacitances for improved performance May. 16, 2023
  • Patent Title: Methods for pillar connection on frontside and passive device integration on backside of die May. 09, 2023
  • Patent Title: Power module having pin fins May. 09, 2023
  • Patent Title: Power semiconductor devices including a trenched gate and methods of forming such devices May. 02, 2023
  • Patent Title: Compensation of trapping in field effect transistors Apr. 04, 2023
  • Patent Title: Die-to-die isolation structures for packaged transistor devices Apr. 04, 2023
  • Patent Title: High electron mobility transistors and power amplifiers including said transistors having improved performance and reliability Mar. 28, 2023
  • Patent Title: Gate trench power semiconductor devices having improved deep shield connection patterns Mar. 21, 2023
  • Patent Title: Edge termination structures for semiconductor devices Mar. 07, 2023
  • Patent Title: Monolithic microwave integrated circuits having both enhancement-mode and depletion mode transistors Feb. 28, 2023
  • Patent Title: Radio frequency transistor amplifiers having leadframes with integrated shunt inductors and/or direct current voltage source inputs Feb. 21, 2023
  • Patent Title: Semiconductor die with improved ruggedness Feb. 21, 2023
  • Patent Title: Radio frequency (rf) transistor amplifier packages with improved isolation and lead configurations Feb. 14, 2023
  • Patent Title: Device design for short-circuitry protection circuitry within transistors Feb. 14, 2023
  • Patent Title: Bypassed gate transistors having improved stability Feb. 07, 2023
  • Patent Title: Power module having an elevated power plane with an integrated signal board and process of implementing the same Feb. 07, 2023
  • Patent Title: Integrated power module Jan. 31, 2023
  • Patent Title: Power semiconductor devices having multilayer gate dielectric layers that include an etch stop/field control layer and methods of forming such devices Jan. 24, 2023
  • Patent Title: Trenched power device with segmented trench and shielding Jan. 24, 2023
  • Patent Title: Radio frequency amplifier implementing an input baseband enhancement circuit and a process of implementing the same Jan. 10, 2023
  • Patent Title: Integrated doherty amplifier with added isolation between the carrier and the peaking transistors Dec. 20, 2022
  • Patent Title: Multi-zone radio frequency transistor amplifiers Dec. 20, 2022
  • Patent Title: Wideband rf short/dc block circuit for rf devices and applications Dec. 06, 2022
  • Patent Title: Dislocation distribution for silicon carbide crystalline materials Dec. 06, 2022
  • Patent Title: Field effect transistor with at least partially recessed field plate Nov. 15, 2022
  • Patent Title: Power semiconductor package Nov. 15, 2022
  • Patent Title: Power module Nov. 15, 2022
  • Patent Title: Vertical semiconductor device with improved ruggedness Nov. 01, 2022
  • Patent Title: High reliability semiconductor devices and methods of fabricating the same Nov. 01, 2022
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