Amkor Technology Inc
AMKR Real Time Price USDRecent trades of AMKR by members of U.S. Congress
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Recently reported changes in AMKR holdings by institutional investors
Quarterly net insider trading by AMKR's directors and management
* Insider trading data parsed from SEC Form 4 filings by Quiver Quantitative. Sign up for the Quiver API for real-time access.
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About
Key Metrics
Return (1d)
Return (30d)
Return (1Y)
CAGR (Total)
Max Drawdown
Beta
Alpha
Sharpe Ratio
Win Rate
Average Win
Average Loss
Annual Volatility
Annual Std Dev
Information Ratio
Treynor Ratio
Total Trades
Metrics Definitions
Disclaimer: The performance results shown are based on historical backtesting and are hypothetical in nature. Backtested performance does not represent actual trading and does not account for all market factors that may affect execution, such as liquidity, slippage, and changing market conditions. Past performance is not necessarily indicative of future results. There is no guarantee that any trading strategy will be profitable or avoid losses.
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Alpha
Measures a portfolio's risk-adjusted performance against that of its benchmark
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Annual Standard Deviation
Measures how much the portfolio's total return varies from its mean or average.
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Annual Volatility
A statistical measure of the dispersion of returns for the portfolio.
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Average Win
The average return (%) for trades that resulted in a positive return.
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Average Loss
The average return (%) for trades that resulted in a negative return.
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Beta
A measure of the volatility of the portfolio compared to the market as a whole.
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CAGR
CAGR (Compounded Annual Growth Rate), is the historical annualized rate of return for an investment strategy, throughout the backtest period.
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Information Ratio
A measurement of portfolio returns beyond the returns of its benchmark compared to the volatility of those returns.
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Max Drawdown
the maximum observed loss from a peak to a trough of a portfolio, before a new peak is attained.
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Sharpe Ratio
The Sharpe Ratio is a measure of historical risk-adjusted return, which quantifies the amount of return that an investor received per unit of risk.
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Total Trades
The total number of trades made by this strategy.
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Treynor Ratio
Attempts to measure how successful an investment is in providing compensation to investors for taking on investment risk.
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Win Rate
The percentage of total trades that resulted in a positive return.
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Government lobbying spending instances
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$60,000 Feb 08, 2007 Issue: Copyright/Patent/Trademark
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$60,000 Aug 10, 2006 Issue: Copyright/Patent/Trademark
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$60,000 Feb 23, 2006 Issue: Copyright/Patent/Trademark
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$60,000 Aug 11, 2005 Issue: Copyright/Patent/Trademark
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$40,000 Feb 14, 2005 Issue: Copyright/Patent/Trademark
AMKR Estimated quarterly lobbying spending
AMKR Revenue by Segment or Geography
New AMKR patent grants
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Patent Title: Packaging for fingerprint sensors and methods of manufacture Mar. 03, 2020
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Patent Title: Fingerprint sensor and manufacturing method thereof May. 29, 2018
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Patent Title: Semiconductor device including leadframe with a combination of leads and lands and method May. 22, 2018
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Patent Title: Semiconductor device and manufacturing method May. 22, 2018
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Patent Title: Packaged electronic device having integrated antenna and locking structure May. 08, 2018
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Patent Title: Semiconductor device package and manufacturing method thereof May. 08, 2018
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Patent Title: Semiconductor device and manufacturing method thereof May. 08, 2018
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Patent Title: Semiconductor device and manufacturing method thereof May. 01, 2018
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Patent Title: Semiconductor device comprising a conductive pad on a protruding-through electrode Apr. 17, 2018
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Patent Title: Semiconductor device and manufacturing method thereof Apr. 10, 2018
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Patent Title: Semiconductor package and manufacturing method thereof Apr. 03, 2018
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Patent Title: Semiconductor package with multiple compartments Apr. 03, 2018
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Patent Title: Semiconductor package and manufacturing method thereof Mar. 27, 2018
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Patent Title: Chip-scale electronic package structure with conductive connective element having increased surface area and laterally spaced connection points for improved connectivity Mar. 27, 2018
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Patent Title: Electronic package structure having insulated substrate with lands and conductive patterns Mar. 20, 2018
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Patent Title: Semiconductor package structure for improving die warpage and manufacturing method thereof Mar. 13, 2018
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Patent Title: Method of forming a semiconductor package with conductive interconnect frame and structure Mar. 13, 2018
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Patent Title: System and method for laser assisted bonding of semiconductor die Mar. 13, 2018
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Patent Title: Land structure for semiconductor package and method therefor Mar. 06, 2018
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Patent Title: Method of manufacturing an electronic device and electronic device manufactured thereby Feb. 27, 2018
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Patent Title: Semiconductor package lid thermal interface material standoffs Feb. 13, 2018
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Patent Title: Method for fabricating semiconductor package and semiconductor package using the same Jan. 30, 2018
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Patent Title: Copper pillar sidewall protection Jan. 23, 2018
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Patent Title: Wafer level package and fabrication method Jan. 16, 2018
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Patent Title: Semiconductor package using a contact in a pleated sidewall encapsulant opening Jan. 16, 2018
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Patent Title: Semiconductor package with clip alignment notch Jan. 16, 2018
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Patent Title: Transient interface gradient bonding for metal bonds Jan. 09, 2018
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Patent Title: Semiconductor package and fabricating method thereof Jan. 02, 2018
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Patent Title: Semiconductor package and fabricating method thereof Dec. 26, 2017
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Patent Title: Manufacturing method of semiconductor device and semiconductor device thereof Dec. 05, 2017
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Patent Title: Semiconductor device having overlapped via apertures Dec. 05, 2017
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Patent Title: Electronic device package and fabricating method thereof Nov. 28, 2017
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Patent Title: Semiconductor device and manufacturing method thereof Nov. 14, 2017
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Patent Title: Semiconductor device with thin redistribution layers Nov. 14, 2017
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Patent Title: Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers Nov. 14, 2017
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Patent Title: Electronic device with a plurality of redistribution structures having different respective sizes Nov. 14, 2017
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Patent Title: Encapsulated semiconductor package Nov. 07, 2017
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Patent Title: Semiconductor package and manufacturing method thereof Nov. 07, 2017
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Patent Title: Semicondutor device with through-silicon via-less deep wells Oct. 24, 2017
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Patent Title: Semiconductor device and manufacturing method thereof Oct. 17, 2017
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Patent Title: Semiconductor package using a coreless signal distribution structure Oct. 03, 2017
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Patent Title: Semiconductor package and manufacturing method thereof Oct. 03, 2017
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Patent Title: Reversible top/bottom mems package Oct. 03, 2017
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Patent Title: Semiconductor package in package Sep. 19, 2017
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Patent Title: Mems package with mems die, magnet, and window substrate fabrication method and structure Sep. 12, 2017
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Patent Title: Packaging for fingerprint sensors and methods of manufacture Sep. 05, 2017
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Patent Title: Wafer level fan out semiconductor device and manufacturing method thereof Aug. 29, 2017
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Patent Title: Method of manufacturing a package-on-package type semiconductor package Aug. 22, 2017
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Patent Title: Encapsulated semiconductor package and method of manufacturing thereof Aug. 22, 2017
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Patent Title: Molded semiconductor package Aug. 15, 2017
Federal grants, loans, and purchases
Estimated quarterly amount awarded to AMKR from public contracts
Recent insights relating to AMKR
Recent picks made for AMKR stock on CNBC
ETFs with the largest estimated holdings in AMKR
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- Is $AMKR stock a Buy, Sell, or Hold?
- What is the price target for $AMKR stock?
* Analyst consensus is not financial advice. Please see our data disclaimers .
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- Who owns $AMKR stock?
- Who owns the most shares of $AMKR stock?
- What funds own $AMKR stock?
* These are estimates based on data taken from SEC filings. There may be inaccuracies due to parsing errors, accidental double-counting, incorrect classification of indirectly owned shares, or any other number of issues.
The Quiver Smart Score combines our data on Congress Trading, Lobbying, Insider Trading, CNBC Mentions and more to provide a comprehensive view of the strength of a stock's underlying data.
The Smart Score grades stocks on a scale of 1 (weakest) to 10 (strongest) based on the strength of the underlying data.Sign Up to view AMKR Smart Score
See concise summaries of analyst reports, presenting both bullish and bearish arguments for a stock.
Example:
The Bulls Say summary highlights positive aspects of the stock.
The Bears Say summary points out potential risks and negative aspects of the stock.
Amkor Technology Inc is a OSAT (outsourced semiconductor assembly and test) service provider. It has pioneered the outsourcing of integrated circuit (IC) packaging and test services and is a strategic manufacturing partner for the semiconductor companies, foundries, and electronics original equipment manufacturers (OEMs). The firm's products are organized into two categories namely advanced products that include flip chip, fine pitch bumping, wafer-level processing, advanced SiPs, power modules, and others, and Mainstream products that includes wirebond packaging and testing. The company derives maximum revenue from the advanced products category. The company derives majority of its revenue from Foreign states.
- Address Tempe, AZ
- Market Cap 10.9 billion
- Employees 28,300
- Industrial Classification Semiconductors & Related Devices