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TTM Technologies Inc

TTMI

TTMI: TTM Technologies Inc manufactures printed circuit boards. The company is based in the United States and derives roughly half of its revenue domestically. The company organizes itself into two segments: printed circuit boards and RF&S Components. The printed circuit boards segment, which contributes the majority of revenue, offers a range of printed circuit boards as well as layout design and simulation, and testing services. TTM Technologies' products are used in manufacturing, networking, telecommunications, computing, aerospace, and medical fields.

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Congress Trading

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Whale Activity

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Insider Trading

Quarterly net insider trading by TTMI's directors and management

Corporate Lobbying

Government lobbying spending instances

  • $110,000 Jul 18, 2023 Issue: Computer Industry Defense
  • $110,000 Apr 20, 2023 Issue: Computer Industry Defense
  • $110,000 Jan 19, 2023 Issue: Computer Industry Defense
  • $130,000 Oct 19, 2022 Issue: Computer Industry Defense
  • $130,000 Jul 20, 2022 Issue: Computer Industry Defense
  • $130,000 Apr 20, 2022 Issue: Computer Industry Defense
  • $130,000 Jan 19, 2022 Issue: None
  • $130,000 Oct 12, 2021 Issue: None
  • $130,000 Jul 16, 2021 Issue: None
  • $130,000 Apr 20, 2021 Issue: None
  • $130,000 Jan 21, 2021 Issue: None
  • $20,000 Oct 21, 2020 Issue: Defense
  • $100,000 Oct 09, 2020 Issue: Defense
  • $20,000 Jul 20, 2020 Issue: Defense
  • $60,000 Jul 15, 2020 Issue: Defense
  • $40,000 Apr 20, 2010 Issue: Government Issues
  • $40,000 Jan 21, 2010 Issue: Government Issues
U.S. Patents

New patents grants

  • Patent Title: Near-hermetic package with flexible signal input and output Aug. 15, 2023
  • Patent Title: Method of manufacturing printed circuit board assemblies with engineered thermal paths Jul. 25, 2023
  • Patent Title: High-density optical waveguide structure and printed circuit board and preparation method thereof Jul. 04, 2023
  • Patent Title: Wideband termination for high power applications Aug. 02, 2022
  • Patent Title: Directional couplers with dc insulated input and output ports Jun. 14, 2022
  • Patent Title: Three-dimensional circuit assembly with composite bonded encapsulation Mar. 15, 2022
  • Patent Title: High powered rf part for improved manufacturability Oct. 26, 2021
  • Patent Title: Methods for fabricating printed circuit board assemblies with high density via array Apr. 13, 2021
  • Patent Title: Wideband termination for high power applications Sep. 08, 2020
  • Patent Title: System for cleaning components for filling holes in a printed circuit board with a fluid fill material May. 21, 2013
  • Patent Title: System for filling holes in a printed circuit board with a fluid fill material Feb. 28, 2012
Government Contracts

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WallStreetBets

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Corporate Flights

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