
Rubicon Technologies, Inc.
RBT
RBT: Rubicon Technologies Inc is a software platform providing full-service waste management, recycling, and smart city technology solutions. It focuses on developing software solutions that bring new transparency to the waste and recycling industry, encouraging customers to make data-driven decisions that lead to more efficient and effective operations as well as more sustainable outcomes.
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Recent trades of RBT by members of U.S. Congress
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New patents grants
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Patent Title: System, method, and medium for recycling app for crowd-sourced recycling Aug. 01, 2023
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Patent Title: System implementing air quality-based waste management Apr. 25, 2023
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Patent Title: System for managing utility and waste services Feb. 07, 2023
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Patent Title: Load monitoring system for waste receptacle Jan. 17, 2023
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Patent Title: System and method for managing waste services Dec. 06, 2022
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Patent Title: System having automated route generation and optimization Nov. 29, 2022
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Patent Title: System for prevention and remediation of environmental contaminants in municipal solid waste and recycling facilities Oct. 25, 2022
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Patent Title: System, method, and app for managing waste services Apr. 12, 2022
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Patent Title: Waste management system having service confirmation Aug. 03, 2021
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Patent Title: Waste management system having unscheduled stop monitoring Jul. 20, 2021
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Patent Title: System having automated route generation and optimization May. 25, 2021
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Patent Title: Method for creating asymmetrical wafer Jul. 12, 2016
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Patent Title: Intelligent machines and process for production of monocrystalline products with goniometer continual feedback Sep. 15, 2015
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Patent Title: Intelligent machines and process for production of monocrystalline products with goniometer continual feedback Jan. 13, 2015
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Patent Title: Ultra-flat, high throughput wafer lapping process May. 27, 2014
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Patent Title: Merchandise display system and method Feb. 25, 2014
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Patent Title: Asymmetrical wafer configurations and method for creating the same Jan. 07, 2014
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Patent Title: Ultra-flat, high throughput wafer lapping process Jul. 09, 2013
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Patent Title: Asymmetrical wafer configurations and method for creating the same Mar. 05, 2013
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Patent Title: Ultra-flat, high throughput wafer lapping process Jan. 08, 2013
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Patent Title: Intelligent machines and process for production of monocrystalline products with goniometer continual feedback Sep. 04, 2012
Federal grants, loans, and purchases
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