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ChipMOS TECHNOLOGIES INC

IMOS

IMOS: ChipMOS TECHNOLOGIES Inc provides semiconductor testing and packaging solutions to fabless companies, integrated device manufacturers, and foundries. Its service targets include semiconductor design companies, integrated component manufacturing companies, and semiconductor wafers factories. The company's segments include Testing, Assembly, Testing, and Assembly for LCD, OLED, and other Display Panel Driver Semiconductors (LCDD), Bumping, and others. The Company derives a majority of its revenue from Taiwan followed by Japan, People's Republic of China, Singapore, and others.

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  • Patent Title: Chip-on-film package structure Feb. 19, 2019
  • Patent Title: Semiconductor device Sep. 04, 2018
  • Patent Title: Multi-chip package structure manufacturing process and wafer level chip package structure manufacturing process Jun. 19, 2018
  • Patent Title: Manufacturing process of wafer level chip package structure having block structure Apr. 24, 2018
  • Patent Title: Semicondcutor light-emitting device and fabricating method thereof Jan. 09, 2018
  • Patent Title: Re-distribution layer structure and manufacturing method thereof Jan. 02, 2018
  • Patent Title: Fingerprint sensor chip package structure and manufacturing method thereof Dec. 19, 2017
  • Patent Title: Insulating protrusion in the trench of a re-distribution layer structure Oct. 17, 2017
  • Patent Title: Solder ball, manufacturing method thereof, and semiconductor device Oct. 03, 2017
  • Patent Title: Semiconductor package Aug. 15, 2017
  • Patent Title: Manufacturing method of chip package structure Aug. 15, 2017
  • Patent Title: Multi-chip package structure, wafer level chip package structure and manufacturing process thereof Aug. 08, 2017
  • Patent Title: Semiconductor package and method of manufacturing thereof Aug. 01, 2017
  • Patent Title: Multi-chip package structure having blocking structure, wafer level chip package structure having blocking structure and manufacturing process thereof May. 16, 2017
  • Patent Title: Chip package structure and method of manufacturing the same Apr. 11, 2017
  • Patent Title: Semiconductor structure and method of manufacturing the same Feb. 21, 2017
  • Patent Title: Chip package structure Sep. 06, 2016
  • Patent Title: Chip package structure and manufacturing method thereof Sep. 06, 2016
  • Patent Title: Quad flat no-lead package and manufacturing method thereof Jul. 26, 2016
  • Patent Title: Flat no-lead package and the manufacturing method thereof Apr. 19, 2016
  • Patent Title: Thermally enhanced electronic package Apr. 05, 2016
  • Patent Title: Chip package structure Feb. 23, 2016
  • Patent Title: Semiconductor package structure and manufacturing method thereof Nov. 24, 2015
  • Patent Title: Manufacturing method for micro bump structure Nov. 17, 2015
  • Patent Title: Conductive structure and method for forming the same Oct. 13, 2015
  • Patent Title: Chip package structure and manufacturing method thereof Sep. 01, 2015
  • Patent Title: Method for wafer level packaging and a package structure thereof Jul. 21, 2015
  • Patent Title: Semiconductor package structure and manufacturing method thereof Jun. 09, 2015
  • Patent Title: Method of manufacturing semiconductor packaging May. 05, 2015
  • Patent Title: Chip structure and multi-chip stack package Apr. 28, 2015
  • Patent Title: Manufacturing method of wafer level package Mar. 17, 2015
  • Patent Title: Qfn package and manufacturing process thereof Feb. 24, 2015
  • Patent Title: Method for manufacturing chip package structure Nov. 25, 2014
  • Patent Title: Semiconductor structure having a silver alloy bump body and manufacturing method thereof Nov. 04, 2014
  • Patent Title: Conductive structure and method for forming the same Oct. 28, 2014
  • Patent Title: Wafer level package structure Sep. 16, 2014
  • Patent Title: Structure of stacking chips and method for manufacturing the same Aug. 19, 2014
  • Patent Title: Conductive structure and method for forming the same Jul. 22, 2014
  • Patent Title: Semiconductor structure having no adjacent bumps between two adjacent pads Jul. 22, 2014
  • Patent Title: Semiconductor structure and manufacturing method thereof Jul. 15, 2014
  • Patent Title: Chip package structure and manufacturing method thereof Jul. 08, 2014
  • Patent Title: Packaging structure May. 27, 2014
  • Patent Title: Chip package structure using flexible substrate May. 13, 2014
  • Patent Title: Computer implemented apparatus for generating and filtering creative proposal Apr. 29, 2014
  • Patent Title: Bump structure and manufacturing method thereof Apr. 15, 2014
  • Patent Title: Semiconductor package structure and manufacturing method thereof Apr. 08, 2014
  • Patent Title: Chip package structure and chip packaging method Feb. 18, 2014
  • Patent Title: Thermally enhanced electronic package Oct. 22, 2013
  • Patent Title: Rfid real-time information system accommodated to semiconductor supply chain Oct. 08, 2013
  • Patent Title: Ventilating apparatus May. 21, 2013
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