Amkor Technology Inc
AMKR Real Time Price USDRecent trades of AMKR by members of U.S. Congress
No Congress Trading data for this ticker
Congress Trading Dashboard
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Recently reported changes by institutional investors
Quarterly net insider trading by AMKR's directors and management
Government lobbying spending instances
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$60,000 Feb 08, 2007 Issue: Copyright/Patent/Trademark
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$60,000 Aug 10, 2006 Issue: Copyright/Patent/Trademark
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$60,000 Feb 23, 2006 Issue: Copyright/Patent/Trademark
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$60,000 Aug 11, 2005 Issue: Copyright/Patent/Trademark
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$40,000 Feb 14, 2005 Issue: Copyright/Patent/Trademark
Estimated quarterly lobbying spending
No Corporate Lobbying data for this ticker
Corporate Lobbying DashboardNew patents grants
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Patent Title: Mems package with mems die, magnet, and window substrate fabrication method and structure Sep. 12, 2017
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Patent Title: Packaging for fingerprint sensors and methods of manufacture Sep. 05, 2017
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Patent Title: Wafer level fan out semiconductor device and manufacturing method thereof Aug. 29, 2017
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Patent Title: Method of manufacturing a package-on-package type semiconductor package Aug. 22, 2017
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Patent Title: Encapsulated semiconductor package and method of manufacturing thereof Aug. 22, 2017
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Patent Title: Molded semiconductor package Aug. 15, 2017
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Patent Title: Stackable via package and method Aug. 08, 2017
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Patent Title: Semiconductor device and manufacturing method thereof Aug. 08, 2017
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Patent Title: Fingerprint sensor and manufacturing method thereof Aug. 08, 2017
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Patent Title: Methods and structures for increasing the allowable die size in tmv packages Aug. 01, 2017
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Patent Title: Semiconductor device redistribution layer with narrow trace width relative to passivation layer opening Jul. 25, 2017
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Patent Title: Thin bonded interposer package Jul. 18, 2017
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Patent Title: Semiconductor package with semiconductor die directly attached to lead frame and method Jul. 18, 2017
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Patent Title: Interposer, manufacturing method thereof, semiconductor package using the same, and method for fabricating the semiconductor package Jul. 11, 2017
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Patent Title: Semiconductor device and manufacturing method thereof Jul. 11, 2017
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Patent Title: Semiconductor device with leadframe configured to facilitate reduced burr formation Jul. 11, 2017
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Patent Title: Micro lead frame structure having reinforcing portions and method Jun. 06, 2017
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Patent Title: Microfluidics sensor package fabrication method and structure Jun. 06, 2017
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Patent Title: Stacked semiconductor package and manufacturing method thereof Apr. 25, 2017
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Patent Title: Semiconductor package and manufacturing method thereof Apr. 25, 2017
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Patent Title: Lead frame package having discharge hole and method of manufacturing the same Apr. 25, 2017
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Patent Title: Semiconductor device including leadframe with a combination of leads and lands and method Apr. 25, 2017
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Patent Title: Semiconductor device using emc wafer support system and fabricating method thereof Apr. 18, 2017
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Patent Title: Method of manufacturing a semiconductor package Apr. 18, 2017
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Patent Title: Laser assisted bonding for semiconductor die interconnections Apr. 18, 2017
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Patent Title: Method for fabricating semiconductor package and semiconductor package using the same Apr. 04, 2017
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Patent Title: Semiconductor device with thin redistribution layers Mar. 28, 2017
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Patent Title: Stress relieving through-silicon vias Mar. 28, 2017
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Patent Title: Embedded die in panel method and structure Feb. 21, 2017
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Patent Title: Embedded trace substrate and method of forming the same Feb. 07, 2017
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Patent Title: Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof Jan. 31, 2017
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Patent Title: Semiconductor device package and manufacturing method thereof Jan. 24, 2017
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Patent Title: Packaged electronic device having reduced parasitic effects and method Jan. 24, 2017
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Patent Title: Semiconductor package and fabricating method thereof Jan. 10, 2017
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Patent Title: Semiconductor package and method therefor Jan. 10, 2017
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Patent Title: Semiconductor device and manufacturing method thereof Jan. 03, 2017
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Patent Title: Semiconductor device and manufacturing method thereof Dec. 20, 2016
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Patent Title: Microfluidic sensor package structure and method Dec. 06, 2016
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Patent Title: Apparatus and method for testing sound transducers Nov. 29, 2016
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Patent Title: Semiconductor device including leadframe with a combination of leads and lands and method Nov. 29, 2016
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Patent Title: Semiconductor device with embedded semiconductor die and substrate-to-substrate interconnects Nov. 22, 2016
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Patent Title: Semiconductor device with plated pillars and leads Nov. 22, 2016
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Patent Title: Robust pillar structure for semicondcutor device contacts Nov. 01, 2016
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Patent Title: Electronic device package structure and method of fabricating the same Oct. 25, 2016
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Patent Title: Lead frame for semiconductor device Oct. 18, 2016
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Patent Title: Semiconductor package in package Oct. 11, 2016
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Patent Title: Semiconductor device and manufacturing method thereof Sep. 20, 2016
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Patent Title: Methods for temporary bussing of semiconductor package substrates Sep. 20, 2016
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Patent Title: Semiconductor device package formed in a chip-on-wafer last process using thin film adhesives Sep. 06, 2016
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Patent Title: Shield lid interconnect package and method Aug. 30, 2016
Federal grants, loans, and purchases
No Government Contracts for this ticker
Government Contracts DashboardEstimated quarterly amount awarded from public contracts
Number of mentions of AMKR in WallStreetBets Daily Discussion
Recent insights relating to AMKR
Recent picks made for AMKR stock on CNBC
ETFs with the largest estimated holdings in AMKR
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* These are estimates based on data taken from SEC filings. There may be inaccuracies due to parsing errors, accidental double-counting, incorrect classification of indirectly owned shares, or any other number of issues.
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