SCHMID Group advances substrate manufacturing with its Any Layer ET process for next-generation advanced packaging solutions.
Quiver AI Summary
SCHMID Group has introduced its proprietary Any Layer ET (Embedded Trace) Process for panel-level Advanced Packaging, aimed at meeting the increasing complexity demands in electronics and semiconductor manufacturing driven by AI and high-performance computing. This innovative process enables precise copper embedding within dielectric layers, resulting in superior electrical performance, reliability, and surface planarity compared to traditional methods. The Any Layer ET platform encompasses advanced techniques for various production tasks, essential for the development of next-generation substrates, including hybrid and glass core options. SCHMID focuses on equipping customers with the necessary production technology without manufacturing substrates directly. Chief Sales Officer Roland Rettenmeier will present the technology at ECTC 2026, emphasizing its role in advancing semiconductor manufacturing.
Potential Positives
- SCHMID Group introduces the Any Layer ET (Embedded Trace) Process, a next-generation substrate manufacturing technology that promises enhanced performance and precision in advanced packaging solutions.
- The new process provides significant advantages including ultra-fine line capabilities, superior surface planarity, improved signal integrity, and full panel-level scalability, which are critical for meeting the increasing demands of AI and HPC applications.
- SCHMID positions itself as a key enabler in the semiconductor industry by supplying both the critical production equipment and the process know-how necessary for industrializing advanced packaging, thereby strengthening its leadership in the market.
- The company’s participation in ECTC 2026, where it will showcase their innovations and engage with industry leaders, emphasizes SCHMID's commitment to technology leadership and facilitates collaboration within the global semiconductor ecosystem.
Potential Negatives
- The press release contains numerous forward-looking statements, which may indicate uncertainty in future performance or outcomes.
- The company emphasizes that it does not manufacture substrates but rather enables customers to industrialize Advanced Packaging, potentially signaling a reliance on third parties that may affect control over product quality and supply chain stability.
- Despite significant advancements in technology mentioned, there is no direct mention of current market performance or client adoption rates, which raises concerns about the commercial viability of the new Any Layer ET process.
FAQ
What is the Any Layer ET Process by SCHMID Group?
The Any Layer ET Process is a full panel-level damascene process for advanced substrate manufacturing, enhancing precision and performance.
How does SCHMID Group support next-generation substrate manufacturing?
SCHMID provides both process technology and critical production equipment to industrialize advanced packaging solutions for customers.
What advantages does the Any Layer ET platform offer?
The platform delivers ultra-fine line capability, superior surface planarity, improved signal integrity, and scalability for cost-efficient high-volume production.
Where will SCHMID Group present their innovations?
SCHMID will present at ECTC 2026 in Orlando, Florida, focusing on advanced packaging and manufacturing strategies.
What industries does the SCHMID Group serve?
SCHMID serves the electronics, photovoltaics, glass, and energy systems industries, developing customized solutions for various advanced technologies.
Disclaimer: This is an AI-generated summary of a press release distributed by GlobeNewswire. The model used to summarize this release may make mistakes. See the full release here.
$SHMD Hedge Fund Activity
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Full Release
FREUDENSTADT, Germany, April 30, 2026 (GLOBE NEWSWIRE) -- SCHMID Group (NASDAQ: SHMD), a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its proprietary Any Layer ET (Embedded Trace) Process for full panel-level Advanced Packaging.
As AI, high-performance computing (HPC), advanced server architectures, and heterogeneous integration continue to drive unprecedented substrate complexity, manufacturers face increasing requirements for ultra-fine line structures, superior signal integrity, enhanced power delivery, and scalable production platforms capable of supporting high-volume manufacturing.
SCHMID’s Any Layer ET process technology is a full panel-level damascene process platform specifically developed for next-generation build-up layer manufacturing. Unlike conventional mSAP and SAP approaches, the technology enables highly precise copper embedding within dielectric layers, delivering superior line definition, improved electrical performance, enhanced reliability, and excellent surface planarity for advanced multilayer package architectures.
The process is particularly suited for advanced IC substrates, panel-level packaging (PLP), glass core substrates, and next-generation high-density interconnect applications requiring ultra-fine redistribution layers (RDL) and vertical interconnect integration.
SCHMID develops and licenses the process technology while supplying the critical production equipment required for industrial implementation. The company does not manufacture substrates itself but enables customers to industrialize Advanced Packaging through an integrated process and equipment platform.
The Any Layer ET platform is built around SCHMID’s core machine portfolio:
- InfinityLine C+ – advanced vertical spin wet processing with best-in-class uniformity and single-panel handling
- PlasmaLine – high-performance plasma processing for dielectric via- and trench-formation, surface activation, and seed layer deposition
- InfinityLine P+ – advanced Electro Chemical Deposition (ECD)
- InfinityLine L+ – full panel Chemical Mechanical Polishing (CMP)
The complete Any Layer ET flow combines Deep Reactive Ion Etching (DRIE) plasma processes for via and trench formation in dielectric materials such as ABF, Physical Vapor Deposition (PVD) for thin-film deposition of titanium and copper seed layers, Electrochemical Deposition (ECD) for copper filling, and Chemical Mechanical Polishing (CMP) for excess copper removal and surface planarization.
This architecture delivers key performance advantages:
- Ultra-fine line and space capability for next-generation substrates
- Superior surface planarity for multilayer build-up architectures
- Improved signal integrity and power distribution performance
- Enhanced long-term reliability through embedded conductor structures
- Full panel-level scalability for cost-efficient HVM production
- Compatibility with organic substrates, hybrid substrates, and glass core platforms
Combined with SCHMID’s touchless transport architecture and single-panel handling concept, the platform ensures maximum cleanliness, reduced defectivity, stable process control, and best-in-class yield performance across large-format panels.
“The future of advanced packaging will be defined by precision, reliability, and scalable manufacturing,” said Roland Rettenmeier, Chief Sales Officer of SCHMID Group. “With Any Layer ET Process and Equipment, SCHMID provides customers with both the process know-how and the critical production equipment required to industrialize next-generation substrate manufacturing for AI-driven compute architectures and future glass core packaging.”
As part of SCHMID’s commitment to technology leadership across the semiconductor ecosystem, Roland Rettenmeier will present at ECTC 2026 in Orlando, Florida, in May 2026.
His presentation, “InfinityBoard – A Panel-Level Glass-Core Packaging Platform for Ultra-Fine RDL and Vertical Interconnect Integration,” will address next-generation substrate manufacturing strategies, panel-level packaging architectures, and the role of Embedded Trace damascene processing in enabling future semiconductor performance scaling.
ECTC 2026 is one of the world’s premier conferences for semiconductor packaging and advanced interconnect technologies, bringing together global leaders from substrate manufacturing, OSATs, semiconductor companies, and equipment suppliers.
“As AI infrastructure demand accelerates, substrate innovation becomes one of the most strategic enablers of overall system performance,” added Rettenmeier. “ECTC provides the ideal platform to engage with the global ecosystem and discuss how full panel-level damascene manufacturing will shape the next generation of advanced packaging.”
SCHMID continues to strengthen its leadership in wet process technologies and advanced packaging solutions, supporting customers worldwide in building the future of semiconductor manufacturing.
Forward-Looking Statements
This press release contains statements that constitute "forward-looking statements". All statements other than statements of historical fact included in this press release are forward-looking statements. Forward-looking statements are subject to numerous conditions, many of which are beyond the control of the Company, including those set forth in the "Risk Factors" section of the Company’s registration statement and final prospectus for the offering filed with the SEC. Copies are available on the SEC’s website, www.sec.gov . The Company undertakes no obligation to update these statements for revisions or changes after the date of this release, except as required by law.
About the SCHMID Group
The SCHMID Group is a global leader in providing solutions for the high-tech industry in the fields of electronics, photovoltaics, glass, and energy systems. SCHMID N.V. and Gebr. SCHMID GmbH are headquartered in Freudenstadt, Germany. Founded in 1864, the company currently employs over 800 people worldwide and operates technology centers and production facilities at multiple locations, including Germany and China, along with several global sales and service locations. The Group focuses on developing customized equipment and process solutions for a variety of industries, including electronics, renewable energy, and energy storage. Our system and process solutions for the production of substrates, printed circuit boards, and other electronic components ensure cutting-edge technology, high yields at low production costs, maximum efficiency, quality, and sustainability through environmentally friendly manufacturing processes.
For more information about the SCHMID Group, please visit:
www.schmid-group.com
Contact
[email protected]
