NXP Semiconductors introduces the i.MX 93W processor, integrating AI NPU and tri-radio connectivity, simplifying design and accelerating deployment.
Quiver AI Summary
NXP Semiconductors has introduced the i.MX 93W applications processor, which is the first of its kind to integrate a dedicated AI neural processing unit (NPU) with secure tri-radio wireless connectivity, allowing for the replacement of up to 60 discrete components. This highly integrated system-on-chip (SoC) is aimed at enhancing the deployment of physical AI applications across various sectors, including healthcare and smart buildings. The i.MX 93W's pre-certified designs simplify wireless certification, thereby accelerating time-to-market and reducing complexity and costs associated with RF design. Supporting applications like smart diagnostics and energy management, it enables coordinated local actions by AI agents with low latency. The processor's robust features include a dual-core Arm Cortex-A55 and integrated connectivity options like Wi-Fi 6 and Bluetooth, along with strong security through the EdgeLock Secure Enclave, making it an attractive solution for developers looking to modernize IoT products. The i.MX 93W is expected to begin sampling in the second half of 2026.
Potential Positives
- First applications processor to combine an AI NPU with secure, tri-radio connectivity, allowing for significant integration by replacing up to 60 discrete components with a single package.
- Pre-certified designs minimize RF integration challenges, reducing complexity, cost, and time-to-market for customers.
- Combines AI acceleration and secure connectivity in a compact architecture, addressing the growing demand for scalable physical AI solutions across various industries.
- Integration of EdgeLock Secure Enclave enhances security and compliance with regulatory requirements, strengthening trust in NXP's offerings for critical applications.
Potential Negatives
- Potential supply chain complexities or challenges in scaling production due to the integration of multiple technologies within a single package.
- Expected sampling of the i.MX 93W in the second half of 2026 may indicate delays in bringing the product to market compared to competitors.
- Heavy reliance on regulatory compliance, such as the European Cyber Resilience Act, presents challenges that may complicate customer integration and market readiness.
FAQ
What is the i.MX 93W applications processor?
The i.MX 93W is the first applications processor combining an AI NPU with secure tri-radio connectivity in one package.
How does the i.MX 93W improve AI deployment?
The i.MX 93W accelerates AI deployment by integrating edge compute and secure connectivity, simplifying system design and reducing complexity.
What are the benefits of pre-certified reference designs?
Pre-certified reference designs minimize RF tuning effort, reducing costs and risks associated with wireless certification, thus speeding up time-to-market.
How does the i.MX 93W enhance wireless connectivity?
The i.MX 93W features integrated Wi-Fi 6, Bluetooth LE, and Thread connectivity, providing robust and simplified wireless communication options.
When will the i.MX 93W be available for sampling?
The i.MX 93W is expected to begin sampling in the second half of 2026.
Disclaimer: This is an AI-generated summary of a press release distributed by GlobeNewswire. The model used to summarize this release may make mistakes. See the full release here.
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Full Release
- First applications processor to combine an AI NPU with secure, tri-radio connectivity, replacing up to 60 discrete components with a single package
- Accelerates coordinated AI agent deployment with integrated edge compute and secure connectivity, supported by NXP software and eIQ® AI enablement
-
Pre-certified designs simplify wireless certification, eliminating RF complexity and speeding time-to-market
NUREMBERG, Germany, March 09, 2026 (GLOBE NEWSWIRE) -- NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the i.MX 93W applications processor, expanding NXP’s i.MX 93 family. Purpose-built to accelerate physical AI deployment, the i.MX 93W SoC is the industry’s first applications processor to combine a dedicated AI neural processing unit (NPU) with secure tri-radio wireless connectivity. This high degree of integration allows customers to replace up to 60 discrete components with a single package. Pre-certified reference designs eliminate many common integration challenges, reducing the complexity, cost and risk traditionally associated with RF design. Supported by NXP’s software and industry-leading eIQ AI enablement solutions, the i.MX 93W also supports smaller form factors and is designed to accelerate time-to-market for physical AI applications.
Physical AI requires coordinated AI agents to collaborate locally, taking real-time action with low latency and high reliability. For example, AI agents might coordinate across a smart building’s lighting, HVAC, access control, occupancy and smart energy systems to autonomously optimize comfort, energy efficiency, and operational responsiveness securely in real time.
NXP’s new i.MX 93W addresses this need by integrating scalable edge compute, AI acceleration, and secure wireless connectivity in a single package, supported by NXP’s software, eIQ AI enablement and pre-certified reference designs. This allows coordinated AI agents to locally manage physical environments, such as a group of healthcare agents working together to coordinate wearables, smart diagnostics, sensors and health gateways that deliver real-time healthcare insights and actions. The highly integrated i.MX 93W SoC also allows customers to rapidly scale physical AI across healthcare devices, smart building controllers, industrial gateways, energy infrastructure monitors and smart home hubs.
“With the i.MX 93W, we’re extending the i.MX 9 family to help customers scale physical AI faster,” said Charles Dachs, Executive Vice President and General Manager, Secure Connected Edge at NXP Semiconductors. “This new platform simplifies integration of AI and secure wireless connectivity, reducing design complexity and allowing customers to more quickly deploy AI agents at the edge.”
Robust Ecosystem Speeds Development
“The new i.MX 93W SoC is an exciting addition to the i.MX portfolio, combining powerful application processing, integrated AI acceleration and secure wireless connectivity in a highly compact SiP architecture," said Andreas Kopietz Dipl.-Ing., Sales Manager, F&S Elektronik Systeme. "For embedded developers, the combination of the i.MX 93 applications processor with integrated Wi-Fi® 6, Bluetooth® LE, Thread and Zigbee significantly simplifies system design and certification. This allows our customers to reduce development effort, lower certification costs and accelerate time-to-market for connected HMI, industrial and IoT devices.”
“As smart IoT gateways and edge-connected devices continue to scale, developers need production-ready platforms with strong wireless performance, security, and power efficiency,” said Ahmed Shameem, Associate Director of System on Modules at iWave. “By offering the i.MX 93W as a fully integrated System on Module with built-in Wi-Fi 6 tri-radio connectivity, we are helping to simplify design, reduce development risk and accelerate time-to-market for next-generation industrial and smart IoT products and applications."
"Vantron is proud to collaborate closely with NXP to bring advanced embedded intelligence to industrial automation,” said Bo Wei, CEO at Vantron Technology.
“As a highly integrated SiP platform combining application processing and Wi-Fi connectivity, i.MX 93W simplifies system design and reduces development and certification efforts. This integration enables our customers to accelerate time-to-market, optimize overall system cost, and deploy robust, secure solutions for the demanding environments of machinery manufacturing, while ensuring long-term operational reliability.”
Integrated Scalable Compute and Secure Connectivity Deliver Physical AI
The
i.MX 93W applications processor
combines a dedicated AI NPU with secure tri-radio wireless connectivity in a single package. This eliminates the need for up to 60 discrete components, significantly reducing board area, design and supply chain complexity and system-level costs. The i.MX 93W features a dual-core Arm® Cortex®A55 applications processor with a dedicated Arm Ethos NPU capable of up to 1.8
eTOPs
. The integrated
IW610 tri-radio
combines Wi-Fi 6, Bluetooth Low Energy, and 802.15.4 connectivity supporting
Matter
and Thread deployments. This eliminates complex RF tuning steps and coexistence challenges that traditionally slow development and certification, speeding time-to-market.
Security by Design with EdgeLock Secure Enclave
The i.MX 93W SoC integrates an
EdgeLock Secure Enclave (Advanced Profile)
, addressing regulatory requirements, including
European Cyber Resilience Act (CRA)
. The embedded EdgeLock Secure Enclave is a hardware root of trust simplifying implementation of security-critical functions like secure boot, secure update, device attestation and secure device access. Combined with
NXP’s EdgeLock 2GO key management services
, OEMs can securely provision i.MX 93W SoC-based products at device manufacturing or in the field.
Pre-Certified Reference Designs Speed Time-to-Market
NXP’s pre-certified i.MX 93W SoC-based single and dual-antenna reference designs minimize RF tuning effort and eliminating many common integration challenges. Certified across multiple countries and regions, these reference designs reduce the complexity, cost and risk traditionally associated with RF design and wireless certification. By leveraging validated antenna options and pre-approved designs, customers can shorten regulatory approval timelines, reduce development cost, and bring products to market faster.
Availability
The i.MX 93W is expected to begin sampling in 2H 2026. For more information, please visit
NXP.com/iMX93W
.
About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) is the trusted partner for innovative solutions in the automotive, industrial & IoT, mobile, and communications infrastructure markets. NXP's "Brighter Together" approach combines leading-edge technology with pioneering people to develop system solutions that make the connected world better, safer, and more secure. The company has operations in more than 30 countries and posted revenue of $12.27 billion in 2025. Find out more at
www.nxp.com
.
EdgeLock, NXP and the NXP logo are trademarks of NXP B.V. All other product or service names are the property of their respective owners. All rights reserved. © 2026 NXP B.V
A photo accompanying this announcement is available at https://www.globenewswire.com/NewsRoom/AttachmentNg/fd0bf1fa-1dc2-4dfc-a2e6-907143b13961